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SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影響因子:2.373 (IEEE T COMP PACK MAN)

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發(fā)表于 2025-3-21 16:06:30 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
期刊全稱(chēng)IEEE Transactions on Components Packaging and Manufacturing Technology
期刊簡(jiǎn)稱(chēng)IEEE T COMP PACK MAN
影響因子20242.373
視頻videohttp://file.papertrans.cn/12/11943/11943.mp4
ISSN2156-3950
eISSN2156-3985
出版商IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
發(fā)行地址445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
學(xué)科分類(lèi)1.Science Citation Index Expanded (SCIE)--Engineering, Manufacturing | Engineering, Electrical & Electronic | Materials Science, Multidisciplinary; 2.Current Contents Electronics & Telecommunications Collection--Signal Processing/Circuits & Systems; 3.Current Contents Engineering, Computing & Technology--Materials Science & Engineering; 4.Essential Science Indicators--Engineering;
出版語(yǔ)言English
The information of publication is updating

SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)影響因子@(材料科學(xué)、多學(xué)科)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)總引論文


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)總引論文@(材料科學(xué)、多學(xué)科)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)總引頻次@(材料科學(xué)、多學(xué)科)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)即時(shí)影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)即時(shí)影響因子@(材料科學(xué)、多學(xué)科)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)五年累積影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)五年累積影響因子@(材料科學(xué)、多學(xué)科)學(xué)科排名


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沙發(fā)
發(fā)表于 2025-3-21 20:18:13 | 只看該作者
Submitted on: 23 July 2000. Revised on: 20 September 2000. Accepted on: 01 October 2000. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
板凳
發(fā)表于 2025-3-22 00:32:57 | 只看該作者
Submitted on: 27 May 2023. Revised on: 24 July 2023. Accepted on: 02 September 2023. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
地板
發(fā)表于 2025-3-22 07:09:23 | 只看該作者
5#
發(fā)表于 2025-3-22 10:44:26 | 只看該作者
Submitted on: 16 August 2014. Revised on: 30 September 2014. Accepted on: 19 October 2014. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
6#
發(fā)表于 2025-3-22 14:17:40 | 只看該作者
7#
發(fā)表于 2025-3-22 18:42:59 | 只看該作者
Submitted on: 03 November 2022. Revised on: 15 December 2022. Accepted on: 05 January 2023. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
8#
發(fā)表于 2025-3-23 01:13:36 | 只看該作者
Submitted on: 27 September 2006. Revised on: 10 December 2006. Accepted on: 21 December 2006. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
9#
發(fā)表于 2025-3-23 05:21:33 | 只看該作者
Submitted on: 15 November 2008. Revised on: 13 March 2009. Accepted on: 27 March 2009. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
10#
發(fā)表于 2025-3-23 08:00:35 | 只看該作者
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