Titlebook: Wafer-Level Chip-Scale Packaging; Analog and Power Sem Shichun Qu,Yong Liu Book 2015 Springer Science+Business Media New York 2015 Analog T

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書目名稱Wafer-Level Chip-Scale Packaging影響因子(影響力)




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書目名稱Wafer-Level Chip-Scale Packaging被引頻次




書目名稱Wafer-Level Chip-Scale Packaging被引頻次學(xué)科排名




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書目名稱Wafer-Level Chip-Scale Packaging年度引用學(xué)科排名




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Obstreperous

Stackable Wafer-Level Analog Chip-Scale Package,ally mentioned as well. More frequently, heat dissipation is one of the mostly concerned areas for the stacked package. Cost of manufacturing the 3D structure seems to be the main hurdle for wider adoptions of the more aggressive 3D package concepts.

fiction

WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.

HARD

WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.

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皺痕

Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging,miconductor industry. This chapter covers in more detail how advances in both the analog and power advanced wafer-level package fan-in/fan-out design and 3D integration have co-enabled significant advances in analog and power device capability during recent years. Extrapolating the same trends in re

Cloudburst

Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.

Keshan-disease

Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.

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Veneer