Titlebook: 3D Microelectronic Packaging; From Fundamentals to Yan Li,Deepak Goyal Book 20171st edition Springer International Publishing AG, part of S

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Book 20171st editionetails, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bond