標(biāo)題: Titlebook: Interconnect Technologies for Integrated Circuits and Flexible Electronics; Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam Book 2024 T [打印本頁] 作者: 口語 時間: 2025-3-21 17:25
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書目名稱Interconnect Technologies for Integrated Circuits and Flexible Electronics被引頻次
書目名稱Interconnect Technologies for Integrated Circuits and Flexible Electronics被引頻次學(xué)科排名
書目名稱Interconnect Technologies for Integrated Circuits and Flexible Electronics年度引用
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書目名稱Interconnect Technologies for Integrated Circuits and Flexible Electronics讀者反饋
書目名稱Interconnect Technologies for Integrated Circuits and Flexible Electronics讀者反饋學(xué)科排名
作者: 得罪人 時間: 2025-3-22 00:02 作者: 舊式步槍 時間: 2025-3-22 02:49
Emerging Interconnect Technologies for Integrated Circuits and Flexible Electronics,d serializer/deserializer, memory and printed/flexible electronics is presented. The chapter offers a comprehensive overview of the most significant trends and advancements in high-speed electronics, making it an indispensable resource for designers and engineers in the field.作者: 特征 時間: 2025-3-22 05:15 作者: pericardium 時間: 2025-3-22 10:06
,PAM3: History, Algorithm, and?Performance Comparison to?NRZ and PAM4, under the influences of five major channel impairments, with NRZ and PAM4 as comparisons. The work reveals that PAM3 has a certain performance advantage over NRZ and PAM4 in terms of reflection coefficient, insertion loss, and mode conversion, while being relatively more sensitive to crosstalk and noise.作者: BLANK 時間: 2025-3-22 15:16 作者: 誰在削木頭 時間: 2025-3-22 17:46 作者: hypertension 時間: 2025-3-23 00:27 作者: 卵石 時間: 2025-3-23 02:38 作者: grandiose 時間: 2025-3-23 07:16
Flexible Sensors for Plant Disease Monitoring,per, we described the reported work for sensing the aforementioned parameters on the flexible substrates. The emphasis has been given on the fabrication of these sensors and their sensor transfer function such as sensitivity, response time, stability, and hysteresis.作者: 無效 時間: 2025-3-23 13:31
2731-4200 g by including contributions from leading experts across the.This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanc作者: 雄辯 時間: 2025-3-23 16:10
Kavicharan Mummaneni,Malvika,Vivek Kumarle aging. The ovarian cortical tissue-based models suggest that there is a very high number of primordial follicle loss in early life from birth to puberty. After the age of 20?years, the average number of follicles lost decreases with the lowest level observed as women approach menopause. It is bel作者: Anecdote 時間: 2025-3-23 20:11
Malvika,Vivek Kumar,Kavicharan Mummanenicyte maturation. We assessed if dual trigger with GnRHa (leuprolide acetate), plus urinary hCG, improves outcomes in minimal stimulation in vitro fertilization (IVF) cycles for patients with expected poor ovarian response (POR). With a first cycle analysis, we observed that dual trigger did not incr作者: 輕快來事 時間: 2025-3-24 00:52
Yash Agrawal,Vinay Palaparthy,Mekala Girish Kumar,Kavicharan Mummaneni,Rajeevan Chandeleems that fertility decline in females may start as early as the late 20s to early 30s. Female age is the most important factor for achieving live birth with assisted reproductive technologies. Many women also postpone pregnancy due to various factors as evidenced by the registry data that the age o作者: 移植 時間: 2025-3-24 06:12
Kavicharan Mummaneni,Vivek Kumar,Malvika,P. Uma Sathyakam important in cell adhesion, cell shape maintenance and as a barrier to metabolites and drugs. The outer fuzzy layer of the wall is composed of proteins and mannoproteins and is involved in pathogenicity, phagocytosis and adherence. The exoskeleton is composed of polymers producing a scaffold that i作者: 斜 時間: 2025-3-24 06:41 作者: 性學(xué)院 時間: 2025-3-24 11:09
Yachana Arora,Vandana Boora,Rohit Dhiman,Rajeevan Chandel important in cell adhesion, cell shape maintenance and as a barrier to metabolites and drugs. The outer fuzzy layer of the wall is composed of proteins and mannoproteins and is involved in pathogenicity, phagocytosis and adherence. The exoskeleton is composed of polymers producing a scaffold that i作者: 抓住他投降 時間: 2025-3-24 17:15
Somesh Kumar,Rahul Kumar important in cell adhesion, cell shape maintenance and as a barrier to metabolites and drugs. The outer fuzzy layer of the wall is composed of proteins and mannoproteins and is involved in pathogenicity, phagocytosis and adherence. The exoskeleton is composed of polymers producing a scaffold that i作者: agglomerate 時間: 2025-3-24 19:55 作者: Bernstein-test 時間: 2025-3-25 00:26
Delay and Overshoot Modelling of Asymmetric T-Tree Interconnects,end on interconnect delay in deep submicron (DSM) technology nodes. The performance and packing density of high functionality chips are limited by the interconnect delay than the overall circuit delay. This paper discusses the delay and overshoot modeling of asymmetric T-tree interconnect. These del作者: Congregate 時間: 2025-3-25 03:24
Explicit Power-Delay Models for On-Chip Copper and SWCNT Bundle Interconnects,n (FDTD) technique. Further, an explicit power estimation model for both on-chip conventional copper and futuristic single-wall carbon nanotube (SWCNT) bundle interconnects using FDTD technique is proposed. The model deals with the analysis of two signaling schemes, namely, voltage-mode signaling (V作者: 腐敗 時間: 2025-3-25 10:20
Modelling and Analysis of Copper and Carbon Nanotube VLSI Interconnects,notube (CNT) interconnects. The proposed model is formulated on the Gaver-Stehfest method, which provides a relation between the time domain function and linear combination of the transfer function values. The values of delay and overshoot in single Cu and CNT lines are estimated for different line 作者: 盤旋 時間: 2025-3-25 15:34 作者: CHAFE 時間: 2025-3-25 19:37
,Through Silicon Vias for 3D Integration—A Mini Review,ther than its planar counterparts. This effective use of space and thus miniaturization has led to a holistic performance enhancement of the very large-scale integration (VLSI) systems. Vertical interconnects or through silicon vias (TSVs) are the foundation of 3D integration. The fabrication techno作者: 上下倒置 時間: 2025-3-25 23:33 作者: 拉開這車床 時間: 2025-3-26 03:44 作者: 事情 時間: 2025-3-26 08:12 作者: 猛烈責(zé)罵 時間: 2025-3-26 08:29
Emerging Interconnect Technologies for Integrated Circuits and Flexible Electronics,eed for?advanced interconnect technologies in catering to faster data transfer, advanced image processing, and stronger computing power, emphasizing the significance of integrating various components into one device. The chapter also analyzes current trends in chip-packages, circuit boards, cables, 作者: 體貼 時間: 2025-3-26 13:10
Contact and Interconnect Considerations for Organic and Flexible Electronics,rature, low cost, and large-area processing along with multi-functional capabilities in devices. Moreover, this technology has shown other important advantages over conventional electronics such as possibility of fabrication with natural materials and biodegradable substrates leading a path toward e作者: Gobble 時間: 2025-3-26 19:10 作者: Alveolar-Bone 時間: 2025-3-27 00:47 作者: travail 時間: 2025-3-27 01:22 作者: PIZZA 時間: 2025-3-27 09:18 作者: 逢迎白雪 時間: 2025-3-27 10:38 作者: 線 時間: 2025-3-27 16:43 作者: deforestation 時間: 2025-3-27 21:02 作者: Acupressure 時間: 2025-3-27 22:50 作者: Circumscribe 時間: 2025-3-28 06:03 作者: mitral-valve 時間: 2025-3-28 08:40 作者: Phonophobia 時間: 2025-3-28 11:13
Yachana Arora,Vandana Boora,Rohit Dhiman,Rajeevan Chandel?-1,6 glucan through a 1,6 linkage of a glucose from the ?1,3 glucan to a GlcNAc residue of the chitin. Wall fractions partially degraded by zymolyase were subjected to two-dimensional [.H] and [.C] NMR and the heteronuclear spectrum confirmed i) a pure glucan of glucose and ii) a ?-linked polymer. 作者: Itinerant 時間: 2025-3-28 14:36
Somesh Kumar,Rahul Kumar?-1,6 glucan through a 1,6 linkage of a glucose from the ?1,3 glucan to a GlcNAc residue of the chitin. Wall fractions partially degraded by zymolyase were subjected to two-dimensional [.H] and [.C] NMR and the heteronuclear spectrum confirmed i) a pure glucan of glucose and ii) a ?-linked polymer. 作者: 不真 時間: 2025-3-28 20:52 作者: FEIGN 時間: 2025-3-28 23:35
2731-4200 able interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies..978-981-99-4478-1978-981-99-4476-7Series ISSN 2731-4200 Series E-ISSN 2731-4219 作者: folliculitis 時間: 2025-3-29 05:14 作者: 厭倦嗎你 時間: 2025-3-29 07:20
Sherman Shan Chen,Francesco de Paulis,David R. Stauffer,Brian Holden作者: 監(jiān)禁 時間: 2025-3-29 13:53 作者: coagulation 時間: 2025-3-29 18:52
Gulafsha Bhatti,Yash Agrawal,Vinay Palaparthy,Mummaneni Kavicharan,Meenu Agrawal作者: projectile 時間: 2025-3-29 21:36 作者: 說不出 時間: 2025-3-30 02:43 作者: 出血 時間: 2025-3-30 04:26 作者: 繁榮地區(qū) 時間: 2025-3-30 10:18 作者: vertebrate 時間: 2025-3-30 12:53
Repeater Insertion for Carbon Nanotube Interconnects, repeaters, and the results are used to train an artificial neural network (ANN). The developed procedure can be applied to the optimal design of interconnect system in nano-CMOS and future nano-carbon-based ICs.作者: 密碼 時間: 2025-3-30 16:48 作者: 某人 時間: 2025-3-31 00:29
Neural Networks for Fast Design Space Exploration of On-Chip Interconnect Networks,e copper conductor, a barrier layer is often positioned around it. Recently, many studies have investigated the potential of employing graphene nanoribbons as a replacement barrier material for Cu interlinks. At ambient temperature, the mean free route for electrons in graphene nanoribbons is much g作者: Mere僅僅 時間: 2025-3-31 04:22 作者: 新陳代謝 時間: 2025-3-31 07:43 作者: GUMP 時間: 2025-3-31 09:22
Flexible Electronics: A Critical Review,erconnects. Flexible substrate holds the flexible electronics. The substrate materials can be conductive polymers, organic semiconductors, graphene derivatives, and amorphous silicon. Further, to withstand large deformation, stretchable interconnects provide the overall flexibility to the electronic
