標題: Titlebook: Electrical Design of Through Silicon Via; Manho Lee,Jun So Pak,Joungho Kim Book 2014 Springer Science+Business Media Dordrecht 2014 3-Dime [打印本頁] 作者: Aggrief 時間: 2025-3-21 17:53
書目名稱Electrical Design of Through Silicon Via影響因子(影響力)
書目名稱Electrical Design of Through Silicon Via影響因子(影響力)學科排名
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書目名稱Electrical Design of Through Silicon Via網(wǎng)絡公開度學科排名
書目名稱Electrical Design of Through Silicon Via被引頻次
書目名稱Electrical Design of Through Silicon Via被引頻次學科排名
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書目名稱Electrical Design of Through Silicon Via年度引用學科排名
書目名稱Electrical Design of Through Silicon Via讀者反饋
書目名稱Electrical Design of Through Silicon Via讀者反饋學科排名
作者: dendrites 時間: 2025-3-22 00:15 作者: Arthropathy 時間: 2025-3-22 00:33
nations.Approach from various view points: signal integrity,.Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approa作者: lambaste 時間: 2025-3-22 07:21 作者: 大量殺死 時間: 2025-3-22 09:45 作者: Corroborate 時間: 2025-3-22 15:08 作者: Corroborate 時間: 2025-3-22 20:49 作者: ANTE 時間: 2025-3-22 22:25 作者: 陰險 時間: 2025-3-23 03:59
Book 2014systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and mea作者: 遺傳學 時間: 2025-3-23 07:30 作者: 強所 時間: 2025-3-23 13:27
Thermal Effects on TSV Signal Integrity,e hundreds-of-MHz frequency range, increasing temperature decreases the S. of TSV channel, but over that frequency range, increasing temperature increases the S.. These phenomena are explained from the model which thermal dependence of the materials is applied.作者: 小步舞 時間: 2025-3-23 17:23
Power Distribution Network Modeling and Analysis for TSV and Interposer-Based 3D ICs in the Frequen interposer-based 3D ICs in the frequency domain with respect to the variations in the main design issues for the PDNs such as the size of grid-type PDNs, the number of power/ground (P/G) TSVs, and the capacitance of the on-chip decoupling capacitors (on-chip decaps).作者: Hay-Fever 時間: 2025-3-23 18:15 作者: 費解 時間: 2025-3-24 00:46
https://doi.org/10.1007/978-3-642-91504-8ng TSV, shielding bump. These methods are compared by showing shielding effectiveness, design restriction, consuming area, and manufacturing process compatibility and the several design guides are provided for choosing the adequate and best way among TSV noise coupling reduction methods considering real products.作者: Cpr951 時間: 2025-3-24 05:14
Noise Coupling and Shielding in 3D ICs,ng TSV, shielding bump. These methods are compared by showing shielding effectiveness, design restriction, consuming area, and manufacturing process compatibility and the several design guides are provided for choosing the adequate and best way among TSV noise coupling reduction methods considering real products.作者: Mere僅僅 時間: 2025-3-24 08:59
this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into?TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered..978-94-017-7949-4978-94-017-9038-3作者: HPA533 時間: 2025-3-24 12:45
https://doi.org/10.1007/978-3-662-35217-5mented using TSV technologies. In this chapter, TSV decoupling schemes are introduced, showing that they have prominent advantages relative to reducing the inductive power distribution network (PDN) impedance and suppressing power noise such as the simultaneously switching noise (SSN) in the 3D ICs.作者: cultivated 時間: 2025-3-24 17:58
TSV Decoupling Schemes,mented using TSV technologies. In this chapter, TSV decoupling schemes are introduced, showing that they have prominent advantages relative to reducing the inductive power distribution network (PDN) impedance and suppressing power noise such as the simultaneously switching noise (SSN) in the 3D ICs.作者: Harness 時間: 2025-3-24 19:40
https://doi.org/10.1007/978-94-017-9038-33-Dimensional Integrated Circuit Design; Clock Distribution Networks; High Speed IC Design; Noise Coupl作者: 尊嚴 時間: 2025-3-25 00:48 作者: 鄙視 時間: 2025-3-25 07:15
Manho Lee,Jun So Pak,Joungho KimProvides fundamental modeling of TSV which is a very essential part of 3D ICs.Includes both numerical formula analysis and qualitative explanations.Approach from various view points: signal integrity,作者: Aspiration 時間: 2025-3-25 09:08
http://image.papertrans.cn/e/image/305712.jpg作者: 裂口 時間: 2025-3-25 14:13 作者: REP 時間: 2025-3-25 19:40 作者: notification 時間: 2025-3-25 22:22 作者: Merited 時間: 2025-3-26 00:10 作者: 比目魚 時間: 2025-3-26 06:57
Grundriss der psychiatrischen Diagnostiklicon via (TSV) noise coupling and S. of TSV channel were measured in both frequency and time domain from corresponding TSV based test vehicle. These measurement results are analyzed using the temperature-dependent TSV lumped model to TSV channel and shows good correlation with measurement. Under th作者: Misgiving 時間: 2025-3-26 10:22 作者: 搏斗 時間: 2025-3-26 14:13 作者: Etymology 時間: 2025-3-26 17:36 作者: 按時間順序 時間: 2025-3-26 21:26
Electrical Modeling of a Through Silicon Via,annel bandwidth and high density integration capability simultaneously. As for the vertical interconnect for a 3D IC, through-silicon via (TSV) is a key component which can provide a significant performance improvement with greatly reduced physical length of channels among vertically integrated chip作者: 的是兄弟 時間: 2025-3-27 04:08 作者: 粘 時間: 2025-3-27 07:32 作者: 皮薩 時間: 2025-3-27 10:37
Thermal Effects on TSV Signal Integrity,licon via (TSV) noise coupling and S. of TSV channel were measured in both frequency and time domain from corresponding TSV based test vehicle. These measurement results are analyzed using the temperature-dependent TSV lumped model to TSV channel and shows good correlation with measurement. Under th作者: ECG769 時間: 2025-3-27 16:06 作者: 精美食品 時間: 2025-3-27 21:39 作者: Congestion 時間: 2025-3-28 00:03
J. Soosai Raj,A. Mayavel,V. N. Mutharaian,A. Nicodemuss featuring business processes and remote services invocation. Process- and service-enabled Web applications benefit from the high-level modeling and automatic code generation techniques that have been fruitfully applied to conventional Web applications, broadening the class of Web applications that作者: 刺激 時間: 2025-3-28 04:41 作者: 藕床生厭倦 時間: 2025-3-28 07:29
The Theory of Joint Play: Distance and Coherence,ge of movement in a joint. There are two kinds of involuntary movements: passive movement in the same direction as active angular movements, and uncontrolled movements along a plane tangential to the joint surface in directions not given (translatory movements).作者: 向外供接觸 時間: 2025-3-28 11:00
Vom Quantenregister zum Quantenschaltkreis,Dieses Kapitel legt notwendige Grundlagen für Verst?ndnis und Entwicklung von Quantenverfahren; es enth?lt aber auch einige überraschende Ergebnisse. Wir beginnen mit einem Schnellkurs ?Laufzeitanalyse von Algorithmen“.作者: palliate 時間: 2025-3-28 15:57
Gil S. Epstein,Shmuel NitzanApplies a single simple methodology, strategic contest theory, to capture the basic forces affecting the relationship between public policy and lobbying or influence activities.It presents five illust
