標(biāo)題: Titlebook: Directions for the Next Generation of MMIC Devices and Systems; Nirod K. Das,Henry L. Bertoni Book 1997 Springer Science+Business Media Ne [打印本頁(yè)] 作者: Body-Mass-Index 時(shí)間: 2025-3-21 19:30
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作者: 寒冷 時(shí)間: 2025-3-21 20:32 作者: 陶瓷 時(shí)間: 2025-3-22 03:21 作者: 作嘔 時(shí)間: 2025-3-22 05:33 作者: molest 時(shí)間: 2025-3-22 09:21
Gesichter der Krise: Eine Begegnungr cost fabrication of circuits with the inherent advantages of small size, low weight, low phase noise, and high reliability and operating life. Unfortunately, the size of static semiconductor devices is limited by capacitive delay effects and by wavelength effects (a. non-traveling wave device larg作者: antidepressant 時(shí)間: 2025-3-22 13:55 作者: antidepressant 時(shí)間: 2025-3-22 18:23
High Density Microwave Packaging Technology Development for Department of Defense Applications. In addition a brief summary will be given of other current and future Air Force microwave packaging programs. Future microwave packaging applications need to address and make advancements in the areas of advanced substrates, key materials and material properties, Computer Aided Design (CAD), Manuf作者: ANN 時(shí)間: 2025-3-23 00:03 作者: 戲服 時(shí)間: 2025-3-23 02:31 作者: 使迷惑 時(shí)間: 2025-3-23 06:54
Broadbanding Guide Lines of Strip-Element Microstrip Phased Arraysip-element is due to an inherent double-tuning mechanism that is revealed only after the scan resonance effects have been eliminated from the desired scan-frequency coverage. A systematic, computer-aided broadbanding design procedure, not detailed here, has been developed. Examples will be presented作者: flammable 時(shí)間: 2025-3-23 11:33
http://image.papertrans.cn/e/image/280681.jpg作者: 有毛就脫毛 時(shí)間: 2025-3-23 15:16
https://doi.org/10.1007/978-1-4899-1480-4Phase; communication; communication systems; development; integrated circuit; interconnect; modeling作者: 抗生素 時(shí)間: 2025-3-23 18:41 作者: Ordeal 時(shí)間: 2025-3-23 22:31
Cleavages: Theoretische GrundlagenA method of achieving high density interconnections is demonstrated through the use of solder free interconnects, between multilayer substrates in which a common technology can be used for both microwave and DC interconnects of large electronic systems.作者: 坦白 時(shí)間: 2025-3-24 03:41
Fragmentierung und Zahl der ParteienThe proposed new class of electrically controlled antennas is an advancement on the integrated phased arrays (IPA) with ferrite control published by Zaitsev et al..作者: decipher 時(shí)間: 2025-3-24 06:53 作者: HIKE 時(shí)間: 2025-3-24 13:43
Patch-MMIC-Ferrite Integration in Novel Phased Array TechnologyThe proposed new class of electrically controlled antennas is an advancement on the integrated phased arrays (IPA) with ferrite control published by Zaitsev et al..作者: 噴油井 時(shí)間: 2025-3-24 18:08 作者: 單純 時(shí)間: 2025-3-24 19:01 作者: Deject 時(shí)間: 2025-3-25 02:19 作者: nepotism 時(shí)間: 2025-3-25 06:54 作者: Glaci冰 時(shí)間: 2025-3-25 10:40 作者: CHANT 時(shí)間: 2025-3-25 15:26 作者: 整理 時(shí)間: 2025-3-25 16:09 作者: 高度 時(shí)間: 2025-3-25 20:00
Sur Une Equation de Hill Singulieree devices by microstrip transmission lines, provides a high level of performance in a small module size at a reasonable cost. For the future, however, a step function improvement in size, weight, and cost of microwave circuit functions is needed. At Texas Instruments, to increase the density and red作者: 哀悼 時(shí)間: 2025-3-26 01:49 作者: Neuralgia 時(shí)間: 2025-3-26 04:46
Gesichter der Krise: Eine Begegnungplanar semiconductor integrated circuit technology, providing the traditional advantages of solid state technology: low cost, low weight, reduced size, low phase noise, high reliability, and long circuit life, to mm-wave systems. These potential advantages are extremely important for applications in作者: 箴言 時(shí)間: 2025-3-26 12:14 作者: 委托 時(shí)間: 2025-3-26 14:12
https://doi.org/10.1007/978-3-658-43059-7pplications. This new integration technique makes it possible to exploit complementary distinctive advantages of planar structures and NRD-guide. Theoretical and experimental studies suggest that this three-dimensional hybrid scheme promise to be an alternative in the design of low-cost millimeter-w作者: BUOY 時(shí)間: 2025-3-26 19:06 作者: sinoatrial-node 時(shí)間: 2025-3-27 00:53 作者: 同步信息 時(shí)間: 2025-3-27 03:56
Overview: 978-1-4899-1482-8978-1-4899-1480-4作者: 災(zāi)禍 時(shí)間: 2025-3-27 08:44 作者: 類(lèi)型 時(shí)間: 2025-3-27 11:21 作者: AWE 時(shí)間: 2025-3-27 14:05
Scanning the Conferences. Current trends are towards low-cost, high-density, multilevel, and multifunctional integration, covering millimeter and submillimeter wave regions. The integration of diverse sub-functions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with co作者: 顧客 時(shí)間: 2025-3-27 18:53
Historical Perspectives on Microwave and Millimeter-Wave Integrated Circuitsosed and built as guiding structures for microwaves. The paper then develops the transition from that elemental form to modern-day microwave and millimeter-wave integrated circuits, including the competition between strip line and microstrip line, by combining the underlying physical principles with作者: Mnemonics 時(shí)間: 2025-3-28 00:49
Mafet Thrust 3: A Revolutionary Program for Solid-State Microwave and Millimeter-Wave Powerena of historical significance. The first was the large U.S. Investment in MMIC technology driven largely by the military need for small, lightweight, and conformable electronically steered active antennas (i.e., phased arrays). Much of this investment was made through the DARPA MIMIC (Microwave and作者: 外向者 時(shí)間: 2025-3-28 02:54 作者: Acetabulum 時(shí)間: 2025-3-28 08:36 作者: brassy 時(shí)間: 2025-3-28 13:17
Flip Chip Power MMICS Packaging Technologyion wire bonds are used to connect the chips to other die or microwave circuits. Flip chip technology uses unthinned (25-mil thick) MMIC chips with bumps on its surface, which, when inverted, are soldered or epoxied directly to a microwave circuit substrate to provide simultaneous die attach and cir作者: 驚惶 時(shí)間: 2025-3-28 18:14
Multilevel Vertical Interconnection Technologyith high circuit density and thus small footprint area are obtained using multilevel circuits. This approach potentially lends itself to a high degree of component integration and reduced cost. Additionally, the small overall depth of the front end allows minimal cost of installation and attractive 作者: Binge-Drinking 時(shí)間: 2025-3-28 20:52
Multilevel Packaging for Low Cost Microwave Functionse devices by microstrip transmission lines, provides a high level of performance in a small module size at a reasonable cost. For the future, however, a step function improvement in size, weight, and cost of microwave circuit functions is needed. At Texas Instruments, to increase the density and red作者: 翅膀拍動(dòng) 時(shí)間: 2025-3-29 02:32
Future Applications of Millimeter Technologylications can be developed based on the MILSTAR system, BCIS and similar systems. It is possible to develop everything from fixed, to multipoint, to mobile. Applications can be both indoor and outdoor. Areas that are being explored currently are short haul, wireless ATM, wireless cable, wireless loc作者: Pedagogy 時(shí)間: 2025-3-29 04:26
Distributed Power Combining and Signal Processing in a 2D Quasi-Optical Systemplanar semiconductor integrated circuit technology, providing the traditional advantages of solid state technology: low cost, low weight, reduced size, low phase noise, high reliability, and long circuit life, to mm-wave systems. These potential advantages are extremely important for applications in作者: HAWK 時(shí)間: 2025-3-29 08:31
Multilayer Integration of Microwave and Millimeter-Wave Circuits: New Interconnect Methods and Desigilayer MMICs. Use of conventional transmission line concepts, such as a microstrip line, a coplanar waveguide and a slotline (that are normally fabricated on a single substrate,) would fail to function properly in a general multilayer environment. The proposed designs are described, with discussion 作者: 形容詞詞尾 時(shí)間: 2025-3-29 14:54 作者: 包租車(chē)船 時(shí)間: 2025-3-29 17:17
Silicon Based On-Wafer and Discrete Packagingchigan. As high frequency circuit design complexity increases so must the design and development of the housing which supports these components. In the past more emphasis was placed on improving integrated circuit (IC) processing technology while research in the area of electronic packaging was mini作者: 焦慮 時(shí)間: 2025-3-29 23:00 作者: 健壯 時(shí)間: 2025-3-30 03:30 作者: BLOT 時(shí)間: 2025-3-30 04:26
Keqin Gu,Vladimir L. Kharitonov,Jie Chen Millimeter-Wave Monolithic Integrated Circuit) and MAFET (Microwave and Analog Front-End Technology) Programs. It has created a design and manufacturing base in MMICs and MMIC-based assemblies and modules that spans across the industrial, military, and academic circles.作者: 迫擊炮 時(shí)間: 2025-3-30 10:50 作者: Condescending 時(shí)間: 2025-3-30 15:38
Sur Une Equation de Hill Singuliereesthetics. These factors could enable a multitude of new applications particularly in the commercial market. An example of this technology is a flat panel phased array which is manufactured by stacking thin panels for the distribution circuit, the T/R modules, and the patch antenna elements on top of each other.作者: Synovial-Fluid 時(shí)間: 2025-3-30 17:49 作者: PTCA635 時(shí)間: 2025-3-30 23:53 作者: 憤慨點(diǎn)吧 時(shí)間: 2025-3-31 01:11 作者: Fantasy 時(shí)間: 2025-3-31 06:39 作者: 好色 時(shí)間: 2025-3-31 10:14
