標(biāo)題: Titlebook: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging; Materials, Processes Kim S. Siow Book 2019 Springer N [打印本頁] 作者: 麻煩 時間: 2025-3-21 16:51
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書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging被引頻次
書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging被引頻次學(xué)科排名
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書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging讀者反饋
書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging讀者反饋學(xué)科排名
作者: 積習(xí)難改 時間: 2025-3-21 22:55 作者: 鐵砧 時間: 2025-3-22 00:54
Process Control of Sintered Ag Joint in Production for Die Attach Applications,eps require additional care because of the absence of self-alignment?and ability to rework in a solid-state sintering process. In addition, the measurement of nano-sized porosity and voids is also crucial to control properties of the sintered Ag joint, such as density, thermal conductivity, and ther作者: handle 時間: 2025-3-22 04:44
Thermomechanical Modeling of High-Temperature Bonded Interface Materials,lar in approach and implementation but different in the underlying theory—are discussed in the context of high-temperature bonded materials. In addition, a short review of sintered silver is provided, as it is widely seen as a potentially promising and reliable bonded material for high-temperature a作者: Migratory 時間: 2025-3-22 09:25 作者: DECRY 時間: 2025-3-22 13:52 作者: DECRY 時間: 2025-3-22 20:45
Die-Attach Materials for Extreme Conditions and Harsh Environments, very long service periods, spanning 5–20?years of operation and in harsh environments, with equipment exposed to challenging environmental conditions with high temperature, shock, and vibration. For downhole reservoir well construction and production equipment, it is paramount to maximize efficienc作者: Banquet 時間: 2025-3-22 23:06
Michael Ruzhansky,Ville Turunent interfaces. Therefore, silver sintering joint may possess porosity, which greatly reduces its bulk mechanical properties such as elastic modulus, yield strength, strength to failure, ultimate tensile strength, and Poisson’s ratio, as well as its thermal and electrical conductivities.作者: conifer 時間: 2025-3-23 02:17 作者: Tincture 時間: 2025-3-23 06:25 作者: 擺動 時間: 2025-3-23 12:57
Emerich Berghofer,Regine Schoenlechnerlar in approach and implementation but different in the underlying theory—are discussed in the context of high-temperature bonded materials. In addition, a short review of sintered silver is provided, as it is widely seen as a potentially promising and reliable bonded material for high-temperature a作者: 口音在加重 時間: 2025-3-23 17:57
John R. N. Taylor,Mary L. Parkerys dealing with patent infringement cases related to nano-materials in the USA, as well as scientists and engineers who are working in the manufacturing industry to appreciate the DOE and PHE while analyzing the relevant patents in their job.作者: 錢財 時間: 2025-3-23 21:55 作者: 油膏 時間: 2025-3-24 00:36 作者: 紀(jì)念 時間: 2025-3-24 03:41
Book 2019erformance of these high-temperature die-attach materials;.Emphasizes the industrial perspective, with chapters written by engineers who?have hands-on experience using these technologies; Baker Hughes, Bosch?and ON Semiconductor, are represented as well as materials suppliers such as Indium;.Simulta作者: CHANT 時間: 2025-3-24 10:16
Die-Attach Materials for High Temperature Applications in Microelectronics PackagingMaterials, Processes作者: 小教堂 時間: 2025-3-24 10:55 作者: 擴(kuò)音器 時間: 2025-3-24 16:34
ective, with chapters written by engineers who?have hands-on experience using these technologies; Baker Hughes, Bosch?and ON Semiconductor, are represented as well as materials suppliers such as Indium;.Simulta978-3-319-99256-3作者: 攝取 時間: 2025-3-24 21:55
Silver Sintering and Soldering: Bonding Process and Comparison,hybrid/electric vehicles, high-speed train, aircraft/aviation, and deep well oil/gas extraction. This chapter focuses on elucidation of the joint formation processes of silver sintering and solder, as well as their comparison. The driving force of silver sintering is particle surface energy reductio作者: 規(guī)章 時間: 2025-3-25 00:26
Sintered Silver for LED Applications,mance, environmental-friendly properties, and economical operation cost..In this chapter, various LED die-attach materials are introduced and compared. A conclusion is drawn after the discussions, that is, as an advanced technique for LED die attachment, sintered Ag?matches well with the requirement作者: Host142 時間: 2025-3-25 06:49
Process Control of Sintered Ag Joint in Production for Die Attach Applications, tools to enable this control and reliability tests. The primary process steps of sintered Ag joints are substrate/wafer printing, preheating, die laminating, placement, and pressure sintering. Unlike solder joint, sintered Ag joint does not form intermetallic with the common substrates used in the 作者: Coronation 時間: 2025-3-25 07:38 作者: consent 時間: 2025-3-25 13:22 作者: judiciousness 時間: 2025-3-25 19:31
Morphological Changes in Sintered Silver Due to Atomic Migration,ature stability of the material at temperatures above 200?°C. Particular aspects that are of interest include the effects of porosity and electromigration. The presence of pores results in a high internal surface area which allows surface diffusion to take place. Grain boundaries also facilitate fas作者: 有惡意 時間: 2025-3-25 23:51 作者: florid 時間: 2025-3-26 01:03
Sintered Copper (Cu): Chemistry, Process, and Reliability,lectrical properties?than other sintered or solder joints. Their thermal?characteristics and and reliability, i.e.?power cycle and thermal cycle tests, are investigated?in this chapter..The Cu nanoparticles with fatty acids and amines were fabricated and examined in?ir thermal and reliability tests.作者: monogamy 時間: 2025-3-26 04:47 作者: myocardium 時間: 2025-3-26 11:09 作者: lambaste 時間: 2025-3-26 14:29 作者: 鋼盔 時間: 2025-3-26 17:34 作者: engrossed 時間: 2025-3-26 21:38
Solenoidal Variable Bochner–Lebesgue Spaces tools to enable this control and reliability tests. The primary process steps of sintered Ag joints are substrate/wafer printing, preheating, die laminating, placement, and pressure sintering. Unlike solder joint, sintered Ag joint does not form intermetallic with the common substrates used in the 作者: hair-bulb 時間: 2025-3-27 02:45
Emerich Berghofer,Regine Schoenlechnere to the coolant. However, these materials are susceptible to failure when the package gets exposed to repeated changes in its thermal environment and internal temperature variations. Under these thermal conditions, the coefficient of thermal expansion mismatch between the different component layers作者: arsenal 時間: 2025-3-27 06:29
John R. N. Taylor,Peter S. Beltongth, and related failure mechanisms under normal and accelerated conditions, as well as failure mechanism like electrochemical migration. While it is technically feasible to produce sintered Ag joint to meet the package design requirement, its long-term reliability is a subject of continuous researc作者: 裹住 時間: 2025-3-27 11:35 作者: 巧思 時間: 2025-3-27 15:30 作者: 羅盤 時間: 2025-3-27 19:04 作者: spondylosis 時間: 2025-3-27 22:16 作者: QUAIL 時間: 2025-3-28 03:23
Holly C. Pinkart,David C. Whiteent scenarios can be found in the following industries: oil and gas, aviation, geothermal drilling and subsurface monitoring, automotive, electrical power systems, combustion engine, nuclear power plant, foundries, glass plants, aluminum and steel mills, cement plant kiln, and aerospace. For all pha作者: GENRE 時間: 2025-3-28 06:40
https://doi.org/10.1007/978-3-319-99256-3Sintered silver; Nano-silver sintering; Low temperature joining technology; Lead-free die attach; Power 作者: Dawdle 時間: 2025-3-28 11:07
Springer Nature Switzerland AG 2019作者: ineptitude 時間: 2025-3-28 17:57 作者: Morsel 時間: 2025-3-28 20:49
http://image.papertrans.cn/d/image/278421.jpg作者: 宣傳 時間: 2025-3-29 00:34
Transient Liquid Phase Bonding, multicomponent alloy technologies based on such liquid alloys are being investigated in the form of films, foils, or particles for interconnect formation in a wide range of electronics applications, both as a substitute for high-Pb solders and as alternative thermal interface materials. In this chapter, we作者: 諄諄教誨 時間: 2025-3-29 06:01 作者: 加劇 時間: 2025-3-29 08:39
s, methods, and performance of these high-temperature die-at.This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In 作者: circuit 時間: 2025-3-29 12:03 作者: 火車車輪 時間: 2025-3-29 16:04
Morphological Changes in Sintered Silver Due to Atomic Migration,t diffusion and are responsible for rapid diffusion between sintered Ag and metallisations such as gold. The electromigration effect occurs when high current densities are present, leading to the electron wind force causing mass transport of Ag, creating voids and nanorods.作者: 規(guī)范就好 時間: 2025-3-29 20:41
John R. N. Taylor,Peter S. Beltoned in this chapter, modifications in Ag?paste formulation, sintering conditions, interfacial metallization, and innovative package designs will be able to alleviate these issues to improve the community’s confidence in this bonding technique.作者: 不朽中國 時間: 2025-3-29 23:59 作者: NOMAD 時間: 2025-3-30 06:01 作者: Spinal-Fusion 時間: 2025-3-30 10:33
Book 2019omics could improve the validity of Ecosystem Services..The concept of ‘Ecosystem Services’ is a relatively recent innovation in environmental thought. The current system is dependent upon mainstream economic theory, in which monetary and fiscal policy controls the prevailing health of the economy.
