標(biāo)題: Titlebook: Design Technology for Heterogeneous Embedded Systems; Gabriela Nicolescu,Ian O‘Connor,Christian Piguet Book 2012 Springer Science+Business [打印本頁] 作者: 建筑物的正面 時(shí)間: 2025-3-21 17:19
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書目名稱Design Technology for Heterogeneous Embedded Systems網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Design Technology for Heterogeneous Embedded Systems被引頻次
書目名稱Design Technology for Heterogeneous Embedded Systems被引頻次學(xué)科排名
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書目名稱Design Technology for Heterogeneous Embedded Systems年度引用學(xué)科排名
書目名稱Design Technology for Heterogeneous Embedded Systems讀者反饋
書目名稱Design Technology for Heterogeneous Embedded Systems讀者反饋學(xué)科排名
作者: Flat-Feet 時(shí)間: 2025-3-21 22:20
Wanlop Atsariyasing,Morris Goldmanuage for systems description combining both hardware and software components. First, it has been recognized that electronic systems design can no longer be seen as an isolated hardware design activity. In addition, recent advances in tools supporting high level hardware synthesis from electronic sys作者: Respond 時(shí)間: 2025-3-22 00:29
Schizophrenia Is a Misdiagnosist a truly executable specification flow is possible, and that it is highly beneficial in the validation and verification of complex systems. This methodology is technology-independent and accommodates a mixture of hardware and software, analog and digital, electronic and micromechanics components.作者: SUGAR 時(shí)間: 2025-3-22 04:46 作者: dithiolethione 時(shí)間: 2025-3-22 09:29
Avinash De Sousa,Amresh Shrivastavaes and design validations. As cycle accurate simulation is very time consuming, and may have a level of accuracy that is not always needed, simulation at higher levels of abstraction is recognized as a way to perform early validation of software. Although even very abstract executable models provide作者: senile-dementia 時(shí)間: 2025-3-22 13:42 作者: senile-dementia 時(shí)間: 2025-3-22 18:13 作者: Serenity 時(shí)間: 2025-3-22 22:54
Why Are Delusions Pathological?on quality design tools. For large systems that defeat formal verification methods, dynamic verification is called on designs directly connected to test generators and signal observers that are compiled from the properties. The quality of tests and debug efficiency are greatly improved. This chapter作者: 遺棄 時(shí)間: 2025-3-23 04:28 作者: 通便 時(shí)間: 2025-3-23 09:07 作者: 易碎 時(shí)間: 2025-3-23 12:24 作者: Expand 時(shí)間: 2025-3-23 14:54 作者: OWL 時(shí)間: 2025-3-23 19:09
https://doi.org/10.1007/978-3-662-02684-7a driver in the research for alternative computation concepts beyond the CMOS. The chapter analyzes first the near term alternative, taking as example the SRAM (Static Random Access Memory). In the second part of the chapter, future circuits based on Carbon Nanotubes (CNTs), Nano-Wires (NWs) and Gra作者: Circumscribe 時(shí)間: 2025-3-23 22:56
Gerd Huber,Gisela Gross,Reinhold Schüttlere communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer communication. However, 3D chips present important thermal issues due to the presence of processi作者: cluster 時(shí)間: 2025-3-24 05:52
https://doi.org/10.1007/978-3-662-02617-5promising solution for heterogeneous system manufacturing, as it provides several benefits in terms of performance and cost. This chapter surveys recent literature on 3D stacking technology. After a brief introduction on trends in the electronics field, 3D integration solutions for heterogeneous sys作者: Expand 時(shí)間: 2025-3-24 07:33 作者: Etching 時(shí)間: 2025-3-24 13:10 作者: Conflict 時(shí)間: 2025-3-24 18:24 作者: staging 時(shí)間: 2025-3-24 21:31 作者: 騙子 時(shí)間: 2025-3-25 02:57 作者: rectum 時(shí)間: 2025-3-25 03:38
978-94-007-9496-2Springer Science+Business Media B.V. 2012作者: 命令變成大炮 時(shí)間: 2025-3-25 11:04 作者: 材料等 時(shí)間: 2025-3-25 15:04
http://image.papertrans.cn/d/image/268452.jpg作者: 他去就結(jié)束 時(shí)間: 2025-3-25 15:51 作者: 樹上結(jié)蜜糖 時(shí)間: 2025-3-25 23:21 作者: 精確 時(shí)間: 2025-3-26 01:23
Multi-physics Optimization Through Abstraction and Refinementmplements the proposed methodology, and its application to a multi-physics example consisting of an active pixel sensor. We demonstrate the formulation of an optimization problem including cross-domain variables, thus enabling the exploration of trade-offs, such as fill-factor and response speed, at an early design stage.作者: 充氣女 時(shí)間: 2025-3-26 05:28
https://doi.org/10.1007/978-3-662-02617-5tems are described. Then, an overview of 3D manufacturing technologies and related concerns is presented. And finally, potential applications are depicted and a particular focus is done on MPSoC architectures for compute intensive systems.作者: Atmosphere 時(shí)間: 2025-3-26 10:14
https://doi.org/10.1007/978-3-7091-6471-6 presented to decrease power consumption of neural recording implants by an order of magnitude. In addition, low-power design techniques, ultra-low-power neural signal processing circuits, and dedicated implementation strategies enabling for high-density multi-channel neural recording microsystem integration are also covered.作者: FLIRT 時(shí)間: 2025-3-26 14:32 作者: 有毛就脫毛 時(shí)間: 2025-3-26 17:59
https://doi.org/10.1007/978-3-662-02684-7ussed for the memory case. Reconfigurable logic circuits based on Double Gate CNTs devices are reviewed for the logic cells. The final part of the chapter is dedicated to the hybrid molecular-CMOS architectures.作者: 致命 時(shí)間: 2025-3-27 00:45
Wireless Design Platform Combining Simulation and Testbed Environmentse design is reduced and the design exploration becomes a complex task. This chapter presents a hybrid platform composed of a simulation tool and a testbed environment to facilitate the design and improve test accuracy of new wireless protocols.作者: uveitis 時(shí)間: 2025-3-27 02:13 作者: chassis 時(shí)間: 2025-3-27 08:19 作者: 桶去微染 時(shí)間: 2025-3-27 10:02
al issues with focus on the modeling, validation and design .Design technology to address the new and vast problem of heterogeneous embedded systems design while remaining compatible with standard “More Moore” flows, i.e. capable of simultaneously handling both silicon complexity and system complexi作者: 生意行為 時(shí)間: 2025-3-27 15:03 作者: Respond 時(shí)間: 2025-3-27 20:16 作者: 休戰(zhàn) 時(shí)間: 2025-3-27 23:09 作者: 靦腆 時(shí)間: 2025-3-28 04:44 作者: figure 時(shí)間: 2025-3-28 07:38
https://doi.org/10.1007/978-3-662-02617-5tical dimensions. In addition, considering the novelty of these technologies, a peculiar attention will be turned towards the models describing memory cell operations and their implementation in electrical simulators to evaluate robustness of innovative architectures.作者: 頑固 時(shí)間: 2025-3-28 12:50
Models for Co-design of Heterogeneous Dynamically Reconfigurable SoCsion allows to integrate reconfigurability features in modern SoCs. Finally a case study is presented for validation purposes. The presented works are based on Model-Driven Engineering (.) and UML MARTE profile for modeling and analysis of real-time embedded systems.作者: 魯莽 時(shí)間: 2025-3-28 16:10 作者: candle 時(shí)間: 2025-3-28 21:47
Trends in Design Methods for Complex Heterogeneous Systems networks, vision sensors and mobile TV. These examples also highlight the heterogeneous nature and the increasing complexity at circuit-level, with the extension from CMOS-only SoCs towards MEMS-and-CMOS SoCs.作者: Abutment 時(shí)間: 2025-3-29 00:07 作者: 策略 時(shí)間: 2025-3-29 04:14 作者: nettle 時(shí)間: 2025-3-29 08:08 作者: expeditious 時(shí)間: 2025-3-29 11:37
Executable Specifications for Heterogeneous Embedded Systemst a truly executable specification flow is possible, and that it is highly beneficial in the validation and verification of complex systems. This methodology is technology-independent and accommodates a mixture of hardware and software, analog and digital, electronic and micromechanics components.作者: negotiable 時(shí)間: 2025-3-29 15:53
Towards Autonomous Scalable Integrated Systemsa, billions of transistors can be assembled to form high-performance systems with varied functionalities. Today we could say that we connect processors for MPSoC design, just as we once assembled transistors for SoC. The building block has evolved and a concomitant paradigm shift is taking place. In作者: finite 時(shí)間: 2025-3-29 20:50 作者: 逢迎春日 時(shí)間: 2025-3-30 03:34
Models for Co-design of Heterogeneous Dynamically Reconfigurable SoCsectures and applications. Thus, seamless methodologies and tools are required to resolve the SoC design issues. This chapter presents a high level component based approach for expressing system reconfigurability in . co-design. A generic model of reactive control is presented for ., a . co-design fr作者: canvass 時(shí)間: 2025-3-30 05:08
Wireless Design Platform Combining Simulation and Testbed Environments create new and improved wireless protocols providing these features. The complexity of these protocols requires fast and accurate validation methodologies. Simulation-based approaches for validation help to capture the expected behavior, but the proposed designs might not work in real life situatio作者: heterogeneous 時(shí)間: 2025-3-30 10:01 作者: Lacunar-Stroke 時(shí)間: 2025-3-30 16:01
Trends in Design Methods for Complex Heterogeneous Systemsel system descriptions with low-level considerations due to technology defaults and variations, and increasing system and circuit complexity. This paper describes the major low-level issues, such as dynamic and static power consumption, temperature, technology variations, interconnect, Design for Ma作者: 跳動(dòng) 時(shí)間: 2025-3-30 19:32 作者: 嬉耍 時(shí)間: 2025-3-31 00:11
Functional Virtual Prototyping for Heterogeneous Systemsts of view. In particular, the technical approach must consider the interactions between physical phenomena and domains. Formalization of global specifications (functional or not), continuous checking of their realization during the whole process, hardware/software co-development, compatibility with作者: Externalize 時(shí)間: 2025-3-31 01:57 作者: 專心 時(shí)間: 2025-3-31 05:15 作者: Affectation 時(shí)間: 2025-3-31 12:53
Through Silicon Via-based Grid for Thermal Control in 3D Chipse communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer communication. However, 3D chips present important thermal issues due to the presence of processi作者: 衰弱的心 時(shí)間: 2025-3-31 15:57 作者: 搖曳 時(shí)間: 2025-3-31 21:35 作者: 秘傳 時(shí)間: 2025-3-31 22:37
Embedded Medical Microsystemss recording applications. Efficient interfacing circuits to measure the weak bioelectrical signal from several cells in the cortical tissues are covered, and high-fidelity data-reduction strategies are demonstrated. Also, on-chip power management schemes based on automatic biopotential detection are作者: 可商量 時(shí)間: 2025-4-1 01:55
