標題: Titlebook: Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics; Sunil P. Khatri,Robert K. Brayton,Alberto L. Sangi Book 2001 Springer Sc [打印本頁] 作者: 雜技演員 時間: 2025-3-21 17:33
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics影響因子(影響力)
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics影響因子(影響力)學科排名
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics網絡公開度
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics網絡公開度學科排名
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics被引頻次
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics被引頻次學科排名
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics年度引用
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics年度引用學科排名
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics讀者反饋
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics讀者反饋學科排名
作者: 使閉塞 時間: 2025-3-21 20:32
https://doi.org/10.1007/978-90-481-8957-1elow 1 .m. Such processes are called Deep Sub-Micron (DSM) processes. With shrinking feature sizes, many new problems arise. Certain electrical problems like cross-talk, electromigration, self-heat and statistical processing variations are becoming increasingly important. Until recently, IC designer作者: 折磨 時間: 2025-3-22 02:31
Paul R. Knowles,Philip A. Daviesure sizes of VLSI ICs (which is described in Section 2). We show analytically that the capacitance of a conductor to its neighboring conductors is becoming an increasing fraction of its total capacitance, thus giving rise to a situation where cross-talk problems become increasingly important. In Sec作者: neurologist 時間: 2025-3-22 05:16
An Intergenerational Study Design,her than this guideline, layout is performed without a strict prior arrangement of wires. This can easily give rise to situations where two or more wires are routed together for long distances on the same metal layer, resulting in crosstalk problems.作者: 苦笑 時間: 2025-3-22 11:42 作者: dragon 時間: 2025-3-22 16:02
METALS REMOVAL FROM INDUSTRIAL EFFLUENTS, resistant design. The use of minimum-sized transistors in the PLA core results in a fast and dense layout, while a structured arrangement of wires guarantees an effective shielding among signals. The speed and area of each PLA in this design style was reported to be about 50% less than the correspo作者: dragon 時間: 2025-3-22 21:02
An Intergenerational Study Design,her than this guideline, layout is performed without a strict prior arrangement of wires. This can easily give rise to situations where two or more wires are routed together for long distances on the same metal layer, resulting in crosstalk problems.作者: 混合物 時間: 2025-3-22 23:22 作者: 閑聊 時間: 2025-3-23 02:28
METALS REMOVAL FROM INDUSTRIAL EFFLUENTS, resistant design. The use of minimum-sized transistors in the PLA core results in a fast and dense layout, while a structured arrangement of wires guarantees an effective shielding among signals. The speed and area of each PLA in this design style was reported to be about 50% less than the corresponding standard-cell based implementation.作者: 神刊 時間: 2025-3-23 08:26 作者: VOK 時間: 2025-3-23 09:49
José Coca-Prados,Gemma Gutiérrez-CervellóIn this chapter we summarize our contributions and point out to some future directions in which this research can be expected to grow.作者: Detonate 時間: 2025-3-23 17:06 作者: 放氣 時間: 2025-3-23 18:41 作者: SOW 時間: 2025-3-24 00:41 作者: Osteons 時間: 2025-3-24 05:38
978-1-4613-5573-1Springer Science+Business Media New York 2001作者: Narcissist 時間: 2025-3-24 10:15 作者: 溫和女人 時間: 2025-3-24 14:26
,Fabric1 — Fabric Cell Based Design,lls .. The routing area between instances of the fabric cells utilizes the DWF fabric. The layout of a fabric cell utilizes the DWF fabric internally. As a result, the DWF fabric is utilized all over the IC layout.作者: RLS898 時間: 2025-3-24 15:52
Wire Removal in a Network of Plas, resistant design. The use of minimum-sized transistors in the PLA core results in a fast and dense layout, while a structured arrangement of wires guarantees an effective shielding among signals. The speed and area of each PLA in this design style was reported to be about 50% less than the corresponding standard-cell based implementation.作者: Herd-Immunity 時間: 2025-3-24 22:16
Introduction,elow 1 .m. Such processes are called Deep Sub-Micron (DSM) processes. With shrinking feature sizes, many new problems arise. Certain electrical problems like cross-talk, electromigration, self-heat and statistical processing variations are becoming increasingly important. Until recently, IC designer作者: 充足 時間: 2025-3-24 23:12 作者: locus-ceruleus 時間: 2025-3-25 03:46 作者: 燒瓶 時間: 2025-3-25 08:56 作者: 宮殿般 時間: 2025-3-25 12:19
Wire Removal in a Network of Plas, resistant design. The use of minimum-sized transistors in the PLA core results in a fast and dense layout, while a structured arrangement of wires guarantees an effective shielding among signals. The speed and area of each PLA in this design style was reported to be about 50% less than the correspo作者: ingenue 時間: 2025-3-25 17:11 作者: 脊椎動物 時間: 2025-3-25 23:05
ds the circuit being implemented into this fabric. The fabric is chosen carefully in order to eliminate the cross-talk problem being faced in modem IC processes. With our choice of fabric, cross-talk between adjacent wires on an IC is reduced by between one and two orders of magnitude. In this way, the fabric978-1-4613-5573-1978-1-4615-1477-0作者: Encephalitis 時間: 2025-3-26 00:15
Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics作者: Arthritis 時間: 2025-3-26 07:53 作者: Paradox 時間: 2025-3-26 12:24 作者: Outshine 時間: 2025-3-26 16:38 作者: 修正案 時間: 2025-3-26 19:40 作者: Hectic 時間: 2025-3-26 21:49 作者: Axon895 時間: 2025-3-27 01:48
Validating Deep Sub-Micron Effects,n 4. Finally, in Sections 5, we experimentally validate the delay variation (Section 5.1) and signal integrity (Section 5.2) problems by means of SPICE [Nagel, 1995] simulations. In Section 6, we review some existing techniques to handle cross-talk.作者: palliate 時間: 2025-3-27 07:03
shrink, a host of electrical problems like cross-talk, electromigration, self-heat, etc. are becoming important. Cross-talk is one of the major problems since it results in unpredictable design behavior. In particular, it can result in significant delay variation or signal integrity problems in a wi作者: dapper 時間: 2025-3-27 13:30 作者: ATP861 時間: 2025-3-27 14:11 作者: appall 時間: 2025-3-27 20:21 作者: convulsion 時間: 2025-3-27 23:16 作者: Parallel 時間: 2025-3-28 02:41
