標(biāo)題: Titlebook: Chiplet Design and Heterogeneous Integration Packaging; John H. Lau Book 2023 The Editor(s) (if applicable) and The Author(s), under exclu [打印本頁] 作者: SPIR 時間: 2025-3-21 17:23
書目名稱Chiplet Design and Heterogeneous Integration Packaging影響因子(影響力)
書目名稱Chiplet Design and Heterogeneous Integration Packaging影響因子(影響力)學(xué)科排名
書目名稱Chiplet Design and Heterogeneous Integration Packaging網(wǎng)絡(luò)公開度
書目名稱Chiplet Design and Heterogeneous Integration Packaging網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Chiplet Design and Heterogeneous Integration Packaging被引頻次
書目名稱Chiplet Design and Heterogeneous Integration Packaging被引頻次學(xué)科排名
書目名稱Chiplet Design and Heterogeneous Integration Packaging年度引用
書目名稱Chiplet Design and Heterogeneous Integration Packaging年度引用學(xué)科排名
書目名稱Chiplet Design and Heterogeneous Integration Packaging讀者反饋
書目名稱Chiplet Design and Heterogeneous Integration Packaging讀者反饋學(xué)科排名
作者: Lumbar-Spine 時間: 2025-3-21 20:39
Chiplet Design and Heterogeneous Integration Packaging作者: aspect 時間: 2025-3-22 00:45 作者: Grating 時間: 2025-3-22 07:13
https://doi.org/10.1007/978-981-19-9917-8Chitlet design; Chip partitioning; Chip splitting; Multiple system and heterogenous integration; Chiplet作者: Radiation 時間: 2025-3-22 09:10 作者: Arbitrary 時間: 2025-3-22 12:57 作者: Arbitrary 時間: 2025-3-22 17:10
Scientific Theories and Their Domainsnce, and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, which will be presented and discussed. Chiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-作者: 使厭惡 時間: 2025-3-22 22:16
Unity and Method in Contemporary Sciencetegration packaging, as shown in Fig.?3.1, namely, (1) multiple system and heterogeneous integration with thin-film layer directly on top of a build-up package substrate (2.1D IC integration), Fig.?3.1a, (2) multiple system and heterogeneous integration with TSV-less interposer (2.3D IC integration)作者: 冷淡周邊 時間: 2025-3-23 03:06 作者: grounded 時間: 2025-3-23 09:19 作者: 嘲笑 時間: 2025-3-23 11:44
The Character of Scientific ChangeIn this chapter, chiplet design and heterogeneous integration packaging.作者: Inferior 時間: 2025-3-23 16:41 作者: synovium 時間: 2025-3-23 19:56
https://doi.org/10.1057/9781403982353Cu-Cu hybrid bonding is one of the flip chip assembly technologies.作者: addict 時間: 2025-3-24 00:06 作者: 出沒 時間: 2025-3-24 06:06
Chiplets Lateral Communications,As mentioned in Chap. ., the key disadvantages of chiplet design and heterogeneous integration packaging are larger packaging size and higher packaging cost.作者: 豐滿有漂亮 時間: 2025-3-24 09:35
Cu-Cu Hybrid Bonding,Cu-Cu hybrid bonding is one of the flip chip assembly technologies.作者: 削減 時間: 2025-3-24 14:00
John H. LauAddresses chiplet design and heterogeneous integraton packaging both in theory and practice.Provides studies in design, materials, process, fabrication, and reliability of various chiplet designs.Writ作者: 獨白 時間: 2025-3-24 16:13 作者: 裂縫 時間: 2025-3-24 22:05 作者: coddle 時間: 2025-3-24 23:42 作者: 做事過頭 時間: 2025-3-25 06:47 作者: 思想靈活 時間: 2025-3-25 10:56 作者: Sigmoidoscopy 時間: 2025-3-25 15:07
State-Of-The-Art of Advanced Packaging,tion packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-count, and metal linewidth and spacing for advanced packaging, are examined.作者: GIBE 時間: 2025-3-25 16:30
Multiple System and Heterogeneous Integration with TSV-Interposers,p package substrate (2.1D IC integration), Fig.?3.1a, (2) multiple system and heterogeneous integration with TSV-less interposer (2.3D IC integration), Fig.?3.1b, and (3) multiple system and heterogeneous integration with TSV interposers (2.5D and 3D IC integration), Fig.?3.1c.作者: WATER 時間: 2025-3-25 20:44 作者: 問到了燒瓶 時間: 2025-3-26 01:07
State-Of-The-Art of Advanced Packaging,nce, and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, which will be presented and discussed. Chiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-作者: MUTED 時間: 2025-3-26 07:13
Multiple System and Heterogeneous Integration with TSV-Interposers,tegration packaging, as shown in Fig.?3.1, namely, (1) multiple system and heterogeneous integration with thin-film layer directly on top of a build-up package substrate (2.1D IC integration), Fig.?3.1a, (2) multiple system and heterogeneous integration with TSV-less interposer (2.3D IC integration)作者: Inexorable 時間: 2025-3-26 10:15
Multiple System and Heterogeneous Integration with TSV-Less Interposers,ses or 2.3D IC integration) will be presented. Unlike 2.5D IC integration discussed in Chap.?., the TSV-interposer is replaced by the TSV-less interposers, which are meanly constructed by the fan-out packaging technology.作者: Tinea-Capitis 時間: 2025-3-26 14:32 作者: Fsh238 時間: 2025-3-26 19:47
Spreading the Word’s Newton PDA in the early 1990s and Microsoft’s Tablet computers a few years later didn’t get the market penetration either of them expected, despite the technology press praising both sets of products.作者: INTER 時間: 2025-3-27 00:43 作者: cataract 時間: 2025-3-27 03:56
Emilia Kielo-Viljamaa,Minna Stolthis study. Our concern here is to sketch how the division of Germany was, firstly, the focus of incipient East-West military conflict; and secondly, how the management and transformation of that military relationship became the principal diplomatic goal of East and West in Europe throughout the post作者: Precursor 時間: 2025-3-27 05:59 作者: nitric-oxide 時間: 2025-3-27 10:06 作者: 反感 時間: 2025-3-27 14:43 作者: 權(quán)宜之計 時間: 2025-3-27 18:51
Denkmalpflege978-3-658-11529-6Series ISSN 2197-6708 Series E-ISSN 2197-6716
