標(biāo)題: Titlebook: CMOS Test and Evaluation; A Physical Perspecti Manjul Bhushan,Mark B. Ketchen Book 2015 Springer Science+Business Media New York 2015 CMOS [打印本頁] 作者: ABS 時間: 2025-3-21 17:59
書目名稱CMOS Test and Evaluation影響因子(影響力)
書目名稱CMOS Test and Evaluation影響因子(影響力)學(xué)科排名
書目名稱CMOS Test and Evaluation網(wǎng)絡(luò)公開度
書目名稱CMOS Test and Evaluation網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱CMOS Test and Evaluation被引頻次
書目名稱CMOS Test and Evaluation被引頻次學(xué)科排名
書目名稱CMOS Test and Evaluation年度引用
書目名稱CMOS Test and Evaluation年度引用學(xué)科排名
書目名稱CMOS Test and Evaluation讀者反饋
書目名稱CMOS Test and Evaluation讀者反饋學(xué)科排名
作者: Mets552 時間: 2025-3-21 22:00 作者: 忍耐 時間: 2025-3-22 03:25 作者: 尊嚴(yán) 時間: 2025-3-22 08:02
IDDQ and Power,d defects contribute to current drawn in the quiescent state of a CMOS chip. Measurement of this current, IDDQ, is useful in eliminating chips with gross defects early in the test flow. DC and AC components of total power in the active mode are functions of power supply voltage, switching activity a作者: 憤慨一下 時間: 2025-3-22 11:15 作者: micturition 時間: 2025-3-22 16:37
Variability,trical tests are defined to cover the range of operating conditions such as power supply voltage and temperature over which any chip may need to function. The data collected are analyzed to isolate factors influencing chip yield and performance. Understanding the various sources of variations and th作者: micturition 時間: 2025-3-22 20:23 作者: 極端的正確性 時間: 2025-3-22 22:22
Reliability,uring test. Models describing various degradation mechanisms in MOSFET and wire interconnect properties over time are provided by the silicon manufacturer and often included in circuit design tools to ensure adequate design margins. Models for failure rates of silicon process-induced defects are gen作者: foliage 時間: 2025-3-23 03:00 作者: 國家明智 時間: 2025-3-23 05:54 作者: 精致 時間: 2025-3-23 10:00
product test debug, yield and performance evaluation.DescribCMOS Test and Evaluation: A Physical Perspective is a single source for an integrated view of test and data analysis methodology for CMOS products, covering circuit sensitivities to MOSFET characteristics, impact of silicon technology proce作者: CLOUT 時間: 2025-3-23 16:34
Hercília Maria Lins Rolim,Thais Cruz Ramalhooss defects early in the test flow. DC and AC components of total power in the active mode are functions of power supply voltage, switching activity and temperature. Circuit design strategies and dynamic on-chip power management schemes help alleviate potential reliability issues and rising energy cost of high performance CMOS chips.作者: Reservation 時間: 2025-3-23 18:49 作者: 不持續(xù)就爆 時間: 2025-3-24 01:31 作者: 誘惑 時間: 2025-3-24 05:57
Christian Ng?,Marcel H. Van de Voordeeir characterization are therefore important components of electrical testing. Efforts are made to maximize yield by accommodating anticipated sources of variations in chip design and by minimizing their impact with continuous improvements in the manufacturing process.作者: 喚起 時間: 2025-3-24 09:56 作者: NIB 時間: 2025-3-24 12:27
Book 2015vering circuit sensitivities to MOSFET characteristics, impact of silicon technology process variability, applications of embedded test structures and sensors, product yield, and reliability over the lifetime of the product. This book also covers statistical data analysis and visualization technique作者: 蘆筍 時間: 2025-3-24 18:22 作者: 極大痛苦 時間: 2025-3-24 21:12 作者: 著名 時間: 2025-3-25 01:08
https://doi.org/10.1007/978-3-030-35147-2hting their interdependencies. Delay chains and ring oscillator configurations used for model validation in silicon hardware are described and simulated to extract delay parameters of logic gates. The foundations laid here including Monte Carlo analysis for determining parameter spreads are used throughout the book.作者: sundowning 時間: 2025-3-25 03:28 作者: conflate 時間: 2025-3-25 09:36
Introduction,mulations. In this chapter an overview of CMOS test, in conjunction with circuit design methodology and silicon technology performance, is provided as an introduction to the material covered in this book.作者: 滑動 時間: 2025-3-25 15:32 作者: Talkative 時間: 2025-3-25 19:52 作者: Indurate 時間: 2025-3-25 21:59
Aswathy Jayakumar,E. K. Radhakrishnanrelated to the properties of their constituent MOSFETs, interconnects, and parasitic resistances and capacitances. Circuit simulation examples to directly extract cycle time and noise margins of an SRAM cell are included.作者: 歹徒 時間: 2025-3-26 01:36 作者: Ballad 時間: 2025-3-26 06:17
Nanoengineering for Material Technology carried out to eliminate chips with potential defects from the manufacturing test flow. Guard-bands between test and field operating conditions are put in place to ensure chip functionality over lifetime.作者: Aerate 時間: 2025-3-26 09:13 作者: 上下倒置 時間: 2025-3-26 13:51 作者: ostensible 時間: 2025-3-26 18:14
Electrical Tests and Characterization in Manufacturing,aggregate behavior of the chip provide physical insight and assist rapid failure diagnostics and resolution. Adaptive testing methods for managing silicon process variations and yield enhancement are becoming increasingly important with shrinking design and profit margins in chips manufactured in advanced CMOS technologies.作者: 欲望 時間: 2025-3-26 23:10 作者: Pantry 時間: 2025-3-27 03:15
CMOS Metrics and Model Evaluation, device and circuit level. For a correct assessment, the integrity of compact models and EDA used tools for chip design needs to be validated over the full design window. The final verdict on the relative merits of different technologies, based on models or hardware data, can only be obtained with limited certainty.作者: commensurate 時間: 2025-3-27 08:42
Variability,eir characterization are therefore important components of electrical testing. Efforts are made to maximize yield by accommodating anticipated sources of variations in chip design and by minimizing their impact with continuous improvements in the manufacturing process.作者: 親屬 時間: 2025-3-27 10:41 作者: 拍翅 時間: 2025-3-27 17:26 作者: reflection 時間: 2025-3-27 19:03 作者: insipid 時間: 2025-3-27 22:15 作者: 暫停,間歇 時間: 2025-3-28 03:10 作者: 思考才皺眉 時間: 2025-3-28 09:41
Aswathy Jayakumar,E. K. Radhakrishnanf individual MOSFETs on CMOS chips in electrical testing is a daunting task. This task is simplified by following the hierarchical nature of chip architecture. Repetitive patterns in data transactions and in writing and reading data in memory arrays are implemented with a small subset of building bl作者: Chromatic 時間: 2025-3-28 14:10 作者: Decongestant 時間: 2025-3-28 18:09
Advanced Technologies and Societal Changes are useful for product yield optimization through silicon process tuning and variability reduction. Appropriately designed embedded process monitors can help bridge both upward in the hierarchy to complex circuitry and downward to the properties of the constituent components and to the silicon man作者: 詞匯 時間: 2025-3-28 20:12
Christian Ng?,Marcel H. Van de Voordetrical tests are defined to cover the range of operating conditions such as power supply voltage and temperature over which any chip may need to function. The data collected are analyzed to isolate factors influencing chip yield and performance. Understanding the various sources of variations and th作者: chemical-peel 時間: 2025-3-29 00:17 作者: Allergic 時間: 2025-3-29 06:11 作者: Digitalis 時間: 2025-3-29 09:22
Christian Ngo,Marcel H. Van de Voordeegree of automation to post-processing of data for rapid feedback and debug. However, domain expertize is a valuable asset and in many cases an essential ingredient for finding the root cause. A brief overview of statistical methods including probability, distributions, correlation, and regression a作者: 抑制 時間: 2025-3-29 15:17
Christian Ng?,Marcel H. Van de Voordeent technology nodes, or between similar technologies on different substrates, such as bulk silicon and SOI. Such comparisons are used in guiding technology development, in benchmarking and selecting the most suitable CMOS manufacturing process or foundry for a given product, and in projecting CMOS 作者: 直言不諱 時間: 2025-3-29 16:55
https://doi.org/10.1007/978-1-4939-1349-7CMOS manufacturing test and quality control; CMOS microelectronic test structures; CMOS products; CMOS
