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標(biāo)題: Titlebook: Boundary-Scan Test; A Practical Approach Harry Bleeker,Peter Eijnden,Frans Jong Book 1993 Springer Science+Business Media Dordrecht 1993 Ha [打印本頁]

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書目名稱Boundary-Scan Test影響因子(影響力)




書目名稱Boundary-Scan Test影響因子(影響力)學(xué)科排名




書目名稱Boundary-Scan Test網(wǎng)絡(luò)公開度




書目名稱Boundary-Scan Test網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Boundary-Scan Test被引頻次




書目名稱Boundary-Scan Test被引頻次學(xué)科排名




書目名稱Boundary-Scan Test年度引用




書目名稱Boundary-Scan Test年度引用學(xué)科排名




書目名稱Boundary-Scan Test讀者反饋




書目名稱Boundary-Scan Test讀者反饋學(xué)科排名





作者: 愛哭    時(shí)間: 2025-3-21 22:15
taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.978-1-4613-6371-2978-1-4615-3132-6
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作者: oblique    時(shí)間: 2025-3-22 12:32
https://doi.org/10.1007/978-3-540-32753-0m in a following section. By searching the minimum test vector set for memory interconnect tests, it is proven that BST is an excellent tool for these type of tests as well. In the last section an architecture of a Boundary-Scan test flow is given.
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作者: 野蠻    時(shí)間: 2025-3-23 07:44
BST Design Languages,can applications in various phases of the product life cycle, where ‘product’ may be defined as IC, PCB or system. Table 4-1 intends to place the various tools in their right context, which may be useful when reading this chapter.
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978-1-4613-6371-2Springer Science+Business Media Dordrecht 1993
作者: 飲料    時(shí)間: 2025-3-23 23:40
Die Nachfrageseite des Luftverkehrsmarktes,uent parts of the Boundary-Scan architecture (both the mandatory and the optional items), are described followed by the instructions. The final section gives some rules which should be followed when BST designs are to be documented. Numerous descriptions are clarified, each with a practical example,
作者: 心胸狹窄    時(shí)間: 2025-3-24 06:12

作者: ovation    時(shí)間: 2025-3-24 07:16
https://doi.org/10.1007/978-3-540-32753-0its integrity before any other test is performed. Next the possible faults during the PCB manufacturing phase are described, followed by a discussion of various test pattern sequences and diagnostic algorithms required to perform board interconnect tests. Cluster testing is treated as a separate ite
作者: 會(huì)議    時(shí)間: 2025-3-24 11:50
https://doi.org/10.1007/978-3-540-32753-0Printed Circuit Boards (PCBs) add the most value to electronics hardware. Over the years, PCBs have become loaded with more components and hence have become increasingly complex and expensive. This is mainly caused by the ongoing miniaturization in electronics.
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作者: 憤慨點(diǎn)吧    時(shí)間: 2025-3-24 22:29
https://doi.org/10.1007/978-3-662-08429-8After an overview of the birth of the IEEE 1149.1 Standard, this chapter describes the measures to be taken in order to introduce Boundary-Scan testing into a company. Points of attention are impacts on the product’s life cycle, product reliability and quality and -most importantly- cost calculations.
作者: 善于騙人    時(shí)間: 2025-3-25 00:58
PCB Testing,Printed Circuit Boards (PCBs) add the most value to electronics hardware. Over the years, PCBs have become loaded with more components and hence have become increasingly complex and expensive. This is mainly caused by the ongoing miniaturization in electronics.
作者: 我要沮喪    時(shí)間: 2025-3-25 04:07
Hardware Test Innovations,This chapter describes provisions that can be made in order to support Boundary-Scan testing for printed circuit boards (PCBs) and a system. A number of on-chip provisions are also illustrated.
作者: 小臼    時(shí)間: 2025-3-25 07:33
Management Aspects,After an overview of the birth of the IEEE 1149.1 Standard, this chapter describes the measures to be taken in order to introduce Boundary-Scan testing into a company. Points of attention are impacts on the product’s life cycle, product reliability and quality and -most importantly- cost calculations.
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