標(biāo)題: Titlebook: Bio and Nano Packaging Techniques for Electron Devices; Advances in Electron Gerald Gerlach,Klaus-Jürgen Wolter Book 2012 Springer-Verlag B [打印本頁(yè)] 作者: 筆記 時(shí)間: 2025-3-21 16:48
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices影響因子(影響力)
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices影響因子(影響力)學(xué)科排名
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices網(wǎng)絡(luò)公開(kāi)度
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices網(wǎng)絡(luò)公開(kāi)度學(xué)科排名
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices被引頻次
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices被引頻次學(xué)科排名
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices年度引用
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices年度引用學(xué)科排名
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices讀者反饋
書(shū)目名稱Bio and Nano Packaging Techniques for Electron Devices讀者反饋學(xué)科排名
作者: cumulative 時(shí)間: 2025-3-21 22:34 作者: Confidential 時(shí)間: 2025-3-22 04:18
Platform Technologies for Pico-liter Printing and Nano-imprintingt high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table?11.1). This chapter will introduce design and properties of the respective equipment.作者: cancellous-bone 時(shí)間: 2025-3-22 05:33
Nanoparticle-Based Resistors and Conductorsacy on top of components with almost any geometry. Additionally, the alignment of filler particles in an electric field by dielectrophoresis is discussed in detail. This technique enables a high conductivity of the composite at a low filling degree and in general a precise adjustment of the electric作者: ABOUT 時(shí)間: 2025-3-22 11:56
Bio and Nano Packaging Techniques for Electron DevicesAdvances in Electron作者: minimal 時(shí)間: 2025-3-22 16:35 作者: 休戰(zhàn) 時(shí)間: 2025-3-22 18:37 作者: BIBLE 時(shí)間: 2025-3-22 21:22 作者: Glycogen 時(shí)間: 2025-3-23 03:43
Koen Lemmink,Michel Brink,Esther Nederhoft high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table?11.1). This chapter will introduce design and properties of the respective equipment.作者: forecast 時(shí)間: 2025-3-23 07:27 作者: 范例 時(shí)間: 2025-3-23 13:18
ogies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers..978-3-642-44286-5978-3-642-28522-6作者: Cholecystokinin 時(shí)間: 2025-3-23 15:49
https://doi.org/10.1007/978-3-642-28522-63D Modelling; Bio-Functionalized Surfaces; Biocompatible Packaging; MEMS; MOEMS; Metallization; NEMS; Nano-作者: 親密 時(shí)間: 2025-3-23 18:54 作者: BET 時(shí)間: 2025-3-23 23:22 作者: 蜿蜒而流 時(shí)間: 2025-3-24 02:40
Produktnutzen und Zielgruppe definieren will be given and the requirements for System in Package (SiP), followed up by More-than-Moore approaches leading to Hetero-System-Integration. One focus of this chapter will lie on the three-dimensional (3D) integration in electronic packages, their assembly and interconnection technologies. This 作者: Jejune 時(shí)間: 2025-3-24 07:22
https://doi.org/10.1007/978-3-658-23959-6nvironment in order to constitute systems with particular complex functions, that match the system to the environment given by the intended application and that secures and maintains the systems properties during entire life-time. It provides the structural scaffold and framework for the functional 作者: 悄悄移動(dòng) 時(shí)間: 2025-3-24 12:31
https://doi.org/10.1007/978-3-658-23959-6ntain the validity of Moore’s law in today’s nano era. In this chapter, an overview of technologies and physical design in the new 3-dimensional context is presented. A survey of modern 3D integration technologies, such as 3D packages and 3D integrated circuits, is given first. The author then inves作者: otic-capsule 時(shí)間: 2025-3-24 14:57 作者: 窩轉(zhuǎn)脊椎動(dòng)物 時(shí)間: 2025-3-24 23:00
Natural History of JSRV in Sheep,rking principles and the manufacturing technology associated with high initial costs for experimental investigations. Uncertainty-based design optimization enables stochastic variables, such as scattering material properties, manufacturing tolerances, stochastic time dependent loads, aging, or wear,作者: 極大的痛苦 時(shí)間: 2025-3-25 03:09 作者: botany 時(shí)間: 2025-3-25 05:43 作者: 抵制 時(shí)間: 2025-3-25 10:57
Surface Information and Analyticityd distances on the nanometer scale with high yieldand small manufacturing tolerances for diverse applicationsincluding devices with high aspect ratio as well as for a wide rangeof different materials. In general, the aim is to produce or deposittwo- or three-dimensional structures in or on top of a 作者: 詞根詞綴法 時(shí)間: 2025-3-25 14:20 作者: Buttress 時(shí)間: 2025-3-25 16:30 作者: Circumscribe 時(shí)間: 2025-3-25 21:02
Jaarboek Fysiotherapie Kinesitherapie 2009rictive for further shrinking of microelectronic and micromechanical devices, because conventional lithography allows resolutions down to 100?nm. So there is a need for newer methods which allow the fabrication of structures in the sub-100?nm range. But the throughput is low and the equipment is exp作者: 平息 時(shí)間: 2025-3-26 00:43 作者: 陪審團(tuán)每個(gè)人 時(shí)間: 2025-3-26 05:43
Ilse Swinkels,Chantal Leemrijseosition method. Although the throughput is not as high as other techniques (e.g. gravure or offset printing) ink-jet printing becomes more and more popular. Printing of conducting structures is one step of producing complex microsystems. Therefor the printing process and the annealing temperature of作者: CHART 時(shí)間: 2025-3-26 09:09
https://doi.org/10.1007/978-90-313-6912-6like electrical conductivity and plasmonic behavior with typical polymer properties, like transparency and elasticity. The possibilities of CPC lead to a new and fascinating application area of nanoparticle-based resistors and conductors, being characterized by properties that can be tailored over a作者: 機(jī)制 時(shí)間: 2025-3-26 12:58
Gerald Gerlach,Klaus-Jürgen WolterProvides solutions for electron device packaging.Comprehensive review of nanoscale materials for packaging.Lists the future trends in nanobiotechniques.Includes supplementary material: 作者: 修改 時(shí)間: 2025-3-26 19:41
http://image.papertrans.cn/b/image/186319.jpg作者: Interferons 時(shí)間: 2025-3-26 22:57 作者: 諄諄教誨 時(shí)間: 2025-3-27 05:01 作者: 1FAWN 時(shí)間: 2025-3-27 05:40 作者: Carminative 時(shí)間: 2025-3-27 10:44
3D Designntain the validity of Moore’s law in today’s nano era. In this chapter, an overview of technologies and physical design in the new 3-dimensional context is presented. A survey of modern 3D integration technologies, such as 3D packages and 3D integrated circuits, is given first. The author then inves作者: Neuropeptides 時(shí)間: 2025-3-27 14:27 作者: 抵制 時(shí)間: 2025-3-27 18:33
Uncertainty-Based Design Optimization of MEMS/NEMSrking principles and the manufacturing technology associated with high initial costs for experimental investigations. Uncertainty-based design optimization enables stochastic variables, such as scattering material properties, manufacturing tolerances, stochastic time dependent loads, aging, or wear,作者: Lacunar-Stroke 時(shí)間: 2025-3-27 22:32
Physical Effects of Nanoparticles and Nanoparticle Ensembles: Impact to System Packagings are right at the edge to enter market-relevant products in medicine and biology, but equally be applied in many inorganic and semiconducting devices. The driving force to take profit from such confined nanomaterials though, might have very different origins, may it be the novelty and challenging n作者: 自然環(huán)境 時(shí)間: 2025-3-28 04:17 作者: Exclude 時(shí)間: 2025-3-28 06:47 作者: 榮幸 時(shí)間: 2025-3-28 13:01 作者: Type-1-Diabetes 時(shí)間: 2025-3-28 16:53
Platform Technologies for Pico-liter Printing and Nano-imprintingvice mounting. Components in the range of a few hundred micrometers must be placed, aligned, and then irreversibly fixed. Because the structural elements are so small and techniques and tools and their handling are scarce, the use of differences in the wetting effects at surfaces are becoming more r作者: 增強(qiáng) 時(shí)間: 2025-3-28 19:53
Nanosphere Lithographyrictive for further shrinking of microelectronic and micromechanical devices, because conventional lithography allows resolutions down to 100?nm. So there is a need for newer methods which allow the fabrication of structures in the sub-100?nm range. But the throughput is low and the equipment is exp作者: 發(fā)起 時(shí)間: 2025-3-29 01:58
Nano Lithography Based on Domain Patterning of Ferroelectricsaphy and their performance testing upon electrical transport. Our results on . single crystal templates show that the deposition of different elemental metals from ionic solutions by photochemical reduction is confined to the ferroelectric 180. domain walls. Current-voltage-characteristics recorded 作者: ESO 時(shí)間: 2025-3-29 06:03
Ink-Jet Printing of Conductive Nanostructuresosition method. Although the throughput is not as high as other techniques (e.g. gravure or offset printing) ink-jet printing becomes more and more popular. Printing of conducting structures is one step of producing complex microsystems. Therefor the printing process and the annealing temperature of作者: Biofeedback 時(shí)間: 2025-3-29 07:33
Nanoparticle-Based Resistors and Conductorslike electrical conductivity and plasmonic behavior with typical polymer properties, like transparency and elasticity. The possibilities of CPC lead to a new and fascinating application area of nanoparticle-based resistors and conductors, being characterized by properties that can be tailored over a作者: intercede 時(shí)間: 2025-3-29 13:18
otechniques.Includes supplementary material: .This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the?effect of nano-sized particles and cell-based approaches for packaging solutions with t作者: magnate 時(shí)間: 2025-3-29 19:06
https://doi.org/10.1007/978-3-658-23959-6xt is presented. A survey of modern 3D integration technologies, such as 3D packages and 3D integrated circuits, is given first. The author then investigates the physical design steps of floorplanning, placement and routing to identify the new design challenges and solutions of 3D nanoscale circuits.作者: Painstaking 時(shí)間: 2025-3-29 20:04
Surface Information and AnalyticityThe results obtained in fundamental experiments pave the way towards applications relevant for future electronic device packaging such as the photochemical fabrication of nanoscale junctions and wirings, the optimization of sensing applications, nanoscale corrosion protection, or the biocompatability of nanostructures.作者: Supplement 時(shí)間: 2025-3-30 01:22 作者: 別名 時(shí)間: 2025-3-30 04:45 作者: 斗志 時(shí)間: 2025-3-30 10:43 作者: 參考書(shū)目 時(shí)間: 2025-3-30 12:38 作者: 成份 時(shí)間: 2025-3-30 18:44
Surface Information and AnalyticityIn this case, the information for theformation of structures is already contained in the material. In this chapter,various approaches are presented for producing nanoscale structuresusing both nanopatterning and self-assembly.作者: jaundiced 時(shí)間: 2025-3-30 21:01
Jaarboek Fysiotherapie Kinesitherapie 2009self-assembled into a hexagonal close-packed monolayer and deposited onto a substrate. Combining related techniques known from semiconductor and microelectromechanical system (MEMS) fabrication, various ordered arrays of nanoparticles, nanotubes and template structures can be prepared.作者: fertilizer 時(shí)間: 2025-3-31 04:05 作者: 敵手 時(shí)間: 2025-3-31 06:31
Physical Effects of Nanoparticles and Nanoparticle Ensembles: Impact to System Packaging will be discussed here in the context of modern type applications. Also the relevant physico-chemical background for such nanoparticles and nanoparticle systems will be given, shedding light on scalability and anisotropy of nanoparticles.作者: Licentious 時(shí)間: 2025-3-31 11:20 作者: Morphine 時(shí)間: 2025-3-31 14:30
