標(biāo)題: Titlebook: Advances in Electronic Circuit Packaging; Volume 5 Proceedings Lawrence L. Rosine (Editor, EDN) Conference proceedings 1965 Springer Scienc [打印本頁(yè)] 作者: 對(duì)將來(lái)事件 時(shí)間: 2025-3-21 16:46
書目名稱Advances in Electronic Circuit Packaging影響因子(影響力)
書目名稱Advances in Electronic Circuit Packaging影響因子(影響力)學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging網(wǎng)絡(luò)公開(kāi)度
書目名稱Advances in Electronic Circuit Packaging網(wǎng)絡(luò)公開(kāi)度學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging被引頻次
書目名稱Advances in Electronic Circuit Packaging被引頻次學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging年度引用
書目名稱Advances in Electronic Circuit Packaging年度引用學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging讀者反饋
書目名稱Advances in Electronic Circuit Packaging讀者反饋學(xué)科排名
作者: 仔細(xì)檢查 時(shí)間: 2025-3-21 23:46 作者: reserve 時(shí)間: 2025-3-22 01:48 作者: 割讓 時(shí)間: 2025-3-22 05:53
https://doi.org/10.1007/978-3-030-49900-6 product of this combined effort has been a reliable command unit with the impressive circuit density of approximately 1100 transistors, 5000 diodes, 2500 resistors, and 200 capacitors, packaged in 32 separate modules in a total volume of 155 in..作者: 浪費(fèi)物質(zhì) 時(shí)間: 2025-3-22 12:04 作者: 良心 時(shí)間: 2025-3-22 15:12
Position sensitive X-ray detectors,wed are interconnection and packaging of thin films and integrated circuits, new motherboarding techniques which minimize back wiring problems yet retain flexibility, and a new concept of simplified prepositioned weldable circuitry for microminiature interconnection applications.作者: 高度表 時(shí)間: 2025-3-22 20:37 作者: vitrectomy 時(shí)間: 2025-3-22 23:54
https://doi.org/10.1007/978-1-0716-3786-9ge capacity. (2) 100-kilocycle serial-bit information rate. (3) Nondestructive readout. (4) 0.3 W maximum power consumption. (5) Approximate volume of 145 in.. (6) Approximate weight of 3.5–4 lb. (7) Operating temperature range of ?20°C? +100°C.作者: 輕浮思想 時(shí)間: 2025-3-23 03:45 作者: 蚊帳 時(shí)間: 2025-3-23 08:05 作者: 生銹 時(shí)間: 2025-3-23 11:06
Springer Series in Optical Sciencesics and advantages of these compounds, transfer molding techniques, and material processing are described in depth in this paper. Detailed information includes electrical characteristics, molding temperatures and pressures, and mold-design data.作者: cunning 時(shí)間: 2025-3-23 15:16 作者: Blazon 時(shí)間: 2025-3-23 20:27 作者: 消耗 時(shí)間: 2025-3-23 22:33
https://doi.org/10.1007/978-1-4899-7307-8circuit; electronic circuit; electronics作者: 整頓 時(shí)間: 2025-3-24 06:00 作者: 忍受 時(shí)間: 2025-3-24 09:52 作者: constitute 時(shí)間: 2025-3-24 14:35 作者: 一美元 時(shí)間: 2025-3-24 17:58
Alison Vermilya,Jeffrey D. Clogstontarlight conditions. The discussion highlights thermal problems, weight considerations, tube mounts, modular packaging of electronic components, structural design, designing for final fabrication without the need for breadboard models, and maintainability features.作者: 步兵 時(shí)間: 2025-3-24 21:55
Jie Xu,Yingwen Hu,Jeffrey D. Clogstondaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined, and manufacturing and maintenance considerations are discussed.作者: Grating 時(shí)間: 2025-3-24 23:25
Alangar Ishwara Bhat,Govind Pratap Raofirst two sections independently consider mechanical layout and interconnection techniques. The third section combines information from the first two, and derives a method for design evaluation. The fourth and final section develops and applies encapsulation methods.作者: ARIA 時(shí)間: 2025-3-25 04:38 作者: Immunoglobulin 時(shí)間: 2025-3-25 10:43
Synchrotron radiation in polymer science,n is centered in this groove is given. The remaining exposed portions of the groove are filled with an encapsulation compound to the height of the aluminum plate. The final step is to plate the encapsulation compound, and in this manner all interconnection runs are completely surrounded by metal, thereby effecting complete shielding of all runs.作者: Estrogen 時(shí)間: 2025-3-25 12:32
https://doi.org/10.1007/978-1-60327-198-1 must be selected that meets the design parameters, the electrical, mechanical, thermal, and environmental requirements. The factual property data necessary for such selection and the comparative advantages and disadvantages of the available encapsulating and potting compounds are tabulated and disc作者: Kinetic 時(shí)間: 2025-3-25 19:31
Timothy M. Potter,Marina A. Dobrovolskaiaminating wires. Over the past several years irradiated heat-shrinkable tubings and molded products have been used in increasing quantities for harness coverings, for the strain relief of wire terminations and connectors, wire markers, and component covers. The new cross-linked heat-shrinkable plasti作者: 即席 時(shí)間: 2025-3-25 22:17
Barry W. Neun,Marina A. Dobrovolskaias of a loose-microballoon system and the advantages derived from their use are also explained. They include the reduced dynamic response expected; however, the ability to repair and rework the unit is not compromised by the encapsulant.作者: Iniquitous 時(shí)間: 2025-3-26 01:10 作者: BRIDE 時(shí)間: 2025-3-26 05:12
Jie Xu,Yingwen Hu,Jeffrey D. Clogstondaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined, and manufacturing and maintenance considerations are discussed.作者: 出來(lái) 時(shí)間: 2025-3-26 09:12
https://doi.org/10.1007/978-1-0716-3786-9r memory system be constructed by use of the same techniques. Some of the characteristics of the proposed system are as follows: (1) 100,000-bit storage capacity. (2) 100-kilocycle serial-bit information rate. (3) Nondestructive readout. (4) 0.3 W maximum power consumption. (5) Approximate volume of作者: chalice 時(shí)間: 2025-3-26 13:54 作者: 有機(jī)體 時(shí)間: 2025-3-26 20:07
https://doi.org/10.1007/978-3-030-49900-6casting, shell and pellet, etc. The specific areas covered include several types of devices, comparing previous encapsulating processes with transfer molding as to quality of encapsulation and as to production costs. A brief run-down of the transfer molding approach, including development work, cost作者: NICE 時(shí)間: 2025-3-27 00:19
Non-Paraxial Electromagnetic Beams,Transfer-molding techniques, along with semiconductor surface passivation techniques, have been developed that eliminate the redundancy of this repackaging of hermetically sealed semiconductor packages. This approach has been used to produce a family of miniature diode assemblies. Easier assembly an作者: osteoclasts 時(shí)間: 2025-3-27 02:44 作者: MIME 時(shí)間: 2025-3-27 05:23
Alangar Ishwara Bhat,Govind Pratap Raofirst two sections independently consider mechanical layout and interconnection techniques. The third section combines information from the first two, and derives a method for design evaluation. The fourth and final section develops and applies encapsulation methods.作者: 睨視 時(shí)間: 2025-3-27 13:14 作者: 無(wú)價(jià)值 時(shí)間: 2025-3-27 16:41
https://doi.org/10.1007/b104970croelectronic elements for spacecraft systems. Essentially a multilayer circuit board is a stack of printed circuit (etched wiring) boards forming a matrix with all interconnecting wiring prefabricated and built in. To determine multilayer circuit design requirements, the problems presented by an ex作者: amputation 時(shí)間: 2025-3-27 19:48
A. Apicella,L. Nicolais,C. de Cataldishe design for the electronics portion of a proposed airborne system starts with component studies and continues through the circuit-board level, striving for an optimum package at minimal overall cost. Versatility of electronic box design is stressed to provide maximum utilization of space, power, a作者: aphasia 時(shí)間: 2025-3-27 22:35 作者: hallow 時(shí)間: 2025-3-28 02:15
Synchrotron radiation in polymer science,n is centered in this groove is given. The remaining exposed portions of the groove are filled with an encapsulation compound to the height of the aluminum plate. The final step is to plate the encapsulation compound, and in this manner all interconnection runs are completely surrounded by metal, th作者: uveitis 時(shí)間: 2025-3-28 06:20
Position sensitive X-ray detectors,eated interconnection nightmares. In many cases the development of these new devices has outstripped interconnection technologies. With proper recognition and consideration of the six basic levels of interconnection—intramodule, module-to-motherboard, intramotherboard, motherboard-to-back-panel, bac作者: 仇恨 時(shí)間: 2025-3-28 13:53 作者: 解決 時(shí)間: 2025-3-28 15:03 作者: apiary 時(shí)間: 2025-3-28 19:06
A Cost and Performance Analysis of Encapsulation by Transfer Molding,978-3-031-41367-4作者: macrophage 時(shí)間: 2025-3-28 23:41 作者: 橫條 時(shí)間: 2025-3-29 06:52 作者: 用肘 時(shí)間: 2025-3-29 10:47
Sergei G. Kazarian,K. L. Andrew Chanas an optional method of interconnecting submodules. The technique provided a practical demonstration for making this type of permanent connection, a connection that could be severed and remade a finite number of times, on 0.050-in. centers. The program has demonstrated the feasibility of utilizing 作者: Indicative 時(shí)間: 2025-3-29 14:02 作者: mortuary 時(shí)間: 2025-3-29 17:42
The Heat-Sink Module,the scope of this book to discuss the merit of their theory of the extraterrestrial origin of life on the Earth, but the corollary of the theory as they have applied it to epidemic influenza must be described and discussed.作者: abduction 時(shí)間: 2025-3-29 22:12
Producibility Norms for Electronic System Packaging,zation including foreign direct investment. The interview was conducted with 26 institutions in 1992. These questionaaires used in the author’s survey are presented in the annex A. The profile of the companies in the author’s survey appears in annex B.作者: COLON 時(shí)間: 2025-3-30 01:28
Use of Radiation-Cross-Linked Materials for Encapsulating and Terminating Devices,design. Thus educational planning becomes the translational design of learning environments. These doctoral dissertations are examples of this approach..The chapters are organised into a narrative that examines978-94-6300-364-3作者: Allure 時(shí)間: 2025-3-30 05:49 作者: cipher 時(shí)間: 2025-3-30 08:32 作者: adumbrate 時(shí)間: 2025-3-30 16:13
A Feasibility Study in Miniaturized Packaging,holarly tendency to over-emphasise local political concerns when explaining this phenomenon, arguing that it is necessary to forefront the complex relationship between local politics and developments in the wid978-3-319-38628-7978-3-319-15413-8作者: indices 時(shí)間: 2025-3-30 17:47 作者: 雪崩 時(shí)間: 2025-3-30 21:09
Designing for Multilayer Circuits,, handle of water faucet [99], sled runner [12], red hot iron nailrod [100], coat hook [78], ice pick [56], walking stick [101], tent pole spike [102], toothbrush (Figure 10) [103], harpoon [104, 105], top of a soft-drink bottle [106], garden cane [107], fern [25], door key [26], oven door spring [108], needlefish [29].作者: META 時(shí)間: 2025-3-31 01:06
Development of Packaging Techniques for a 960-Bit Plated-Wire Memory,onstrates not only the influence of Japanese culture on their work, but also Japan as a place against which they wrote, a site of resistance and contested identity. More importantly, their transnational experience occasioned the production of hybrid practices, forms, and identities.作者: aggravate 時(shí)間: 2025-3-31 07:43
Encapsulants for Electronic Packaging,utations at position 2583 increased the translational accuracy. These results, together with those of mutations at positions G2505, G2583, G2607, and G2608 . and G2505 and G2583 . will be summarized here.作者: 諂媚于性 時(shí)間: 2025-3-31 12:33 作者: 欺騙世家 時(shí)間: 2025-3-31 15:25
,Packaging Computer Circuitry for Space Applications—A Two-Part Compendium,examine the significance and role of the specter in ., beyond the symbolic and cognitive meanings attributed to its presence. It will read the framing of the ghostly apparitions in the narrative as examples of del Toro’s attempts to redefine the gothic mode on the screen.作者: CAB 時(shí)間: 2025-3-31 21:17
High-Frequency Interconnections,place AZA, and mycophenolate mofetil is beginning to replace AZA in a small number of centers (Chapter 70). In addition, some centers include induction cytolytic therapy with an anti-T-cell polyclonal (an antithymocyte (ATG)/antilymphocyte (ALG) globulin) or monoclonal (OKT3) antibody.
